Description

Pro-Grade Silicone Technology Evolution leads to Outstanding Thermal Performance

Pro-grade Silicone technology evolution thermal compound delivers a stable and reliable thermal performance. Minimised resistance and maximised efficiency truly enables you to get more from your cooler. RoHS compliant.

Features
– Outstanding performance of heat transfer between CPU and heatsink.
– Low thermal resistance for heat transfer, 0.16cmC/W @60 um BLT.
– Maximum thermal conductivity, 3.3W/mK.
– Electrically non-conductive.
– Low bleed under high pressure.
– Multi-language instructions included.

Application Thermally conductive compound
Form Non-curing
Thermal conductivity 3.3 W/mK
Specific gravity 3.5
Operating temperature -45C to 200C
Thermal resistance 0.16cmC/W @60um BLT
Colour Grey
Volume 3.5g
Product code AK-460